Silver paste NC-601 is designed for printed circuits, membrane switch and flexible electronics applications. It combines silver powders, resin from top tier manufacturers, and unique formulations, which results in excellent printability, conductivity and flexibility. NC-601 is used for screen printing.

Silver-copper paste NC-802 is designed for printed circuits, membrane switch and flexible electronics applications. It combines silver-copper powders, resin from top tier manufacturers, and unique formulations, which results in excellent printability, conductivity, flexibility and reasonable cost. NC-802 is used for screen printing, and can be used as a cost-effective alternative of NC-601.

Silver Copper Adhesive NA-702 is single part adhesive that can be used in microelectronics packaging. It consists of silver coated copper powders and epoxy resin in the formulation, which serves as a cost-effective alternative for NA-701. NA-702 can be used to bond Si, Al2O3, Cu foil, Al foil and PCB. The recommended curing condition 150 ºC，30 min.

Conductive adhesive NA-701 is single part adhesive that can be used in microelectronics packaging. It consists of silver powders and epoxy resin in the formulation. The main advantages include excellent electrical conductivity (1 × 10-4 ohm•cm), thermal conductivity (10W/m•K) and shear strength (10 MPa). NA-702 can be used to bond Si, Al2O3, Cu foil, Al foil and PCB. The recommended curing condition i

Carbon paste NR-110 is designed for printed circuits, membrane switch and flexible electronics applications. It combines carbon blacks, graphite powders, polymer resin and unique formulations, which results in excellent conductivity and flexibility. NR-110 is used for screen printing.

New products are under development and will be launched soon